Goertek at CES 2026: Acoustics, MEMS and AI Wearables
At the 2026 Consumer Electronics Show (CES), which ran from 6 to 9 January 2026, Goertek unveiled its latest technology solutions across acoustics and sensing. These innovations enable consumer electronics manufacturers to deliver more immersive, precise, and comfortable interactive experiences.
Traditional wearables now face a plateau. Conventional shapes and familiar interaction modes hold them back. Devices such as TWS earbuds rely heavily on voice commands, making them difficult to use in noisy environments. They also miss multimodal AI interaction and visual contextual awareness. Goertek addresses those gaps by combining acoustics, vision, and AI in what it calls the industry’s first OWS earbuds reference design. This design delivers high-quality open audio, AI multimodal interaction, ultra-high-definition binaural photography, and HD short-video capture.
Each earpiece integrates a 12-megapixel camera and supports three adjustable viewing angles. A real-time live-view function helps users calibrate the wear angle across different ear shapes. Proprietary algorithms handle facial de-occlusion and binaural image stitching. They enable ultra-HD photo capture with a horizontal field of view that exceeds 100 degrees, alongside 1080p short video recording.
Goertek uses a near-field pickup algorithm that filters ambient and bystander noise with precision. It enables multimodal AI fusion for "Voice + Binaural Image" interaction. Goertek also applies a proprietary shallow in-ear acoustic solution and dual-diaphragm driver units. These components reduce sound leakage, strengthen bass depth, and raise loudness in OWS products. They maintain a comfortable open-ear experience while delivering consistent high-fidelity audio.
Manufacturers now push for thinner devices while demanding higher-fidelity sound, and core acoustic components must meet both goals. At CES 2026, Goertek showcased new SPK (micro-speaker) platforms, MEMS acoustic sensors, and audio technology solutions. These solutions help brands differentiate at the product level.
Goertek introduced the LBS speaker platform to boost volume in open-style speakers. It uses a dual-radiation, single-sided sound structure that delivers high loudness. It also improves the balance between comfortable wear and clear audio in open-style designs. The platform adds privacy protection technology and uses a far-field cancellation design to reduce sound leakage.
Goertek also debuted what it describes as the industry’s first ultra-thin, large-volume F platform for foldable phones and tablets. The widely recognised DR earphone driver series continues to deliver stable performance. Goertek upgraded its proprietary Sandwich platform to version 2.0, significantly improving waterproofing. For smart glasses, Goertek launched three generations of SPK options, spanning standard, custom, and modular units to suit a range of industrial designs.
In haptics, Goertek uses its "Dual" Dual-Frequency Bi-Directional System to deliver "true 4D vibration. The system produces distinct vibration textures and reproduces directional cues with realism, even in compact devices. Goertek also continues to refine its ultra-compact, high-performance LRA series for smartphones, balancing performance and size. The LRA090835SH matches the performance of larger components in a smaller form factor. The LRA159519 reduces the thickness to 1.9mm.
Goertek draws on its electromagnetic design expertise for ultra-small Twist Air and IPD modules. These modules use efficient drive systems and smooth transmission structures. They deliver fast, precise feedback and support lighter, more space-constrained designs.
Demand continues to rise for compact, waterproof, and ultra-thin acoustic components. Goertek’s subsidiary, Goermicro, displayed targeted MEMS sensor innovations to meet that demand. A compact IP68 MEMS acoustic sensor uses a third-generation waterproof architecture to achieve IP68 protection in an ultra-small 2.75×1.85mm footprint. It supports the lightweight, small-form-factor requirements that smartphones and smartwatches demand, while maintaining high reliability. Goermicro also offers an ultra-thin, high-performance acoustic sensor that delivers a 68dB signal-to-noise ratio at a height of just 0.8mm.
Goermicro also presented a VPU (Vibration/Voice Pickup) Sensor. It operates at a low power level of 120-125μA. It accurately captures voice vibration signals while isolating environmental noise, making voice interaction more responsive and precise. It also supports universal audio interface compatibility, which positions it as a sensing solution for slim, reliable interaction in AI glasses.
In audio algorithms, Goertek targets reduced voice recognition performance with its proprietary ASR Front-End Processing Solution. It combines directional pickup through multi-microphone arrays with deep learning-based noise cancellation algorithms. It achieves 98% recognition accuracy in near-field use and 97% in far-field use. It captures commands in noisy settings such as shopping centres or underground stations while supporting real-time operation on low-power chips.
Goertek will continue to pursue breakthroughs in core acoustics and sensing. It will translate system-level innovation into differentiated product experiences and long-term industry value.